Technical Highlights
Clamping Unit
BFC (Balanced Force Clamping) Technology: Ensures platen parallelism <0.05mm under load and uniform mold pressure distribution.
TBF (Tie Bar Free) Design: Eliminates contamination with wear-resistant tie bars and a clean mold area.
Third-Gen DCPC (Digital Closed-Loop Positioning Control): Achieves turntable positioning accuracy within ±0.03mm.
Linear Rail System: Enables fast mold opening/closing (0.02mm directional accuracy) and low energy consumption.
Intelligent Mold Protection: Detects minute obstacles to prevent damage during faulty operations.
Injection Unit
High Repeatability: Uses 2-million-pulse encoders for ultra-precise speed/position control.
LGS (Linear Guide Support) Technology: Enhances rigidity and reduces friction for consistent performance.
Modular L/V-Type Units:
L-Type: Horizontal configuration for core-pull, hot runner, and sequential valve integration.
V-Type: Vertical design for flexible multi-material molding (e.g., dual-color parts).
LSR/TPU Barrel Options: Specialized screws prevent material stagnation and leakage (e.g., LSR mixing screws with water-cooled nozzles).
SDC (Servo Direct Control): Independent control of injection/plasticizing for faster response and precision.
Hydraulic System
KEBA Controller : Features a 15" HD touchscreen, OPC-UA interface, and real-time SPC (Statistical Process Control).
Multi-CPU Synchronization : 1ms scanning time for rapid motion coordination.
Smart Energy Monitoring : Optional energy meters analyze consumption for optimization.
Remote Operation : USB/RS485/Ethernet connectivity for MES integration and parameter storage.